AC impedance function of electrochemical working station as novel curing degree monitor method: A model curing system of epoxy/anhydride/DMP-30
By Han, Yufeng; Wang, Zhi; Zhao, Song; Wang, Jixiao
Published in Measurement
2019
Abstract
This paper presents a novel method based on AC impedance for monitoring the curing process of epoxy resin. Effects of DMP-30 and temperature on the reaction rate and curing degree were investigated here. Experimental results showed that DMP-30 has significant influence on reaction rate of the curing system, and the resin system, containing 1.5 wt% DMP-30 can be cured completely in the shortest time at 80 °C. Impedance analysis showed that the curing degree increased obviously with increasing temperature, while the curing time got shortened sharply. DSC technique was also employed here to verify the effectivity of impedance analysis of curing degree, and a good agreement between AC impedance and DSC was observed, especially at higher temperature, demonstrating the great potential application of AC impedance in field of cure monitoring.