The description of the copper deposition/dissolution process in ammonia buffer with the application of mathematical two-plate model
By Skitał ‚, Piotr M.; Sanecki, PrzemysLaw T. & GibaLa, Katarzyna
Published in Electrochimica Acta
2014
Abstract
The experimental Cu2+/Cu+/Cu0 system in ammonia buffer (pH = 9.25) has been investigated by cyclic voltammetry method and described by the advanced two-plate model with BET adsorption equation. A change of electrode properties during electrode process is included into the applied model. The model reproduces four one-electron peaks of electronation/deelectronation process together with a characteristic loop on cathodic part of CV response and covers 0.1; 0.2, 0.5; 1; 2; 5; 10; 20; 50 mM concentrations of Cu2+ at scan rate range 0.05–5 V/s. The values of elementary kinetic parameters have been determined, validated and discussed. It has been proved that CV technique and two-plate model is adequate to cover complete description of the deposition process for the wide range of concentration. The parameters of applied BET adsorption model coupled with kinetic parameters of electrochemical process model have been extensively discussed.